1、1.Metalbump金屬凸塊-C4process(IBM)2.Tape-Automatedbonding捲帶接合-ACFprocess3.Anisotropicconductiveadhesives異方向性導電膠-ACPprocess4.Polymerbump高分子凸塊-C4process5.Studbump.打線成球-ACPprocess(Matsushita)FlipChipconductivemethod-connecttoSubstrate/PCBC4:controlledcollapsechipconnection
2、ACF:anisotropicconductivefilmACP(ACA):anisotropicconductiveAdhesivepasteKingbondTrainingCourseKingbondTrainingCourseVariousflipchiptechnologiesPS:WIT(Wireinterconnecttechnology)TAB(Tape-automatedbonding)KingbondTrainingCourseVariousflipchiptechnologiesKingbondTraining
3、CourseStudBumpFlipChipBondUnderfillCureovenCureovenSBBProcessC4:ControlledCollapseChipConnectionProcessKingbondTrainingCourseReflowovenFlipchipbonderFluxcleanerUnderfilldispenserCureoven1.Fluxcoatingorre-printing2.MountingHeatingCleaningDispensingHeatingWaferbumpBumpbyso
4、lderACP:AnisotropicConductivePasteProcessReflowovenFlipchipbonderUnderfilldispenserCureovenThermosettingDispensingHeating1.PrinttheACA2.AlignmentWaferbumpBumpbyAgKingbondTrainingCourseACF:AnisotropicConductiveFilmProcessACFPre-setterFlipchipbonderPressandcureequipmentAC
5、FPre-setting1.MountingWaferbumpBumpbyAuKingbondTrainingCourseOvercoatwithpolymideandopenthebumpareas.PatternwettablebasemetalCoatchipwithpolymide,openviasovereachpadUseddry-filmlift-offprocesstodefinebasemetalandsolderoneachpadPatternaluminumtore-routeI/Oto
6、onareaarrayConventionalchipwithaluminumI/OpadsaroundtheperimeterTack,Flux&ReflowPrint,Place&ReflowKingbondTrainingCourseFCTBumpStructureSiliconwaferUBM-UnderBumpMetallurgySolderBumpFinalMetalPadDiePassivationWaferBumpKingbondTrainingCourse1.蒸鍍Evaporation2.濺鍍Sputte
7、r3.電鍍Electroplating4.印刷Printedsolderpastebump5.錫球焊接SolderballbumpingorStudbumpbonding(SBB)6.無電鍍鎳ElectrolessnickeltechnologiesMetalbumpmethodUBMKingbondTrainingCourse1.95Sn/5Pb,97Sn/3Pb高溫錫鉛合金2.63Sn/37Pb低溫錫鉛合金3.Ni鎳4.Au金5.Cu銅MaterialofsolderbumpKingbondTrainingCo
8、urseSiliconWaferarriveswithanaluminumbasedfinalmetalpadanddiepassivation.Wafercanbeprobedpriortobumping.Waferbump(Printedmethod)Process:WafercleanKingbondTrainingCourseTheUnderBumpMetallurgyisaddedbyFCTthroughsputteredlayersofAl,Ni-V,&CuWaferBump(Printedmeth
9、od)Process:SputterUBMAl/Ni/Cu(Au)KingbondTrainingCourseUBMconsist3layer:1.Adhesionlayer:Ti,Cr,TiW提供鋁墊(Alpad)與護層(Passivationlayer)有較強之黏著性2.Wettinglayer:Ni,Cu,Mo,Pt高溫迴焊時錫球可完全沾附而成球3.Protectivelayer:Au保護Ni,Cu等免於被氧化.WaferBump(Evaporationmethod)Process:SputterUBMKingbondTrain
10、ingCourseApplyphotoresist,PatternanddevelopWaferBump(Printedmethod)Process:Photo-resistKingbondTrainingCourseEtchtoformUBMcapWaferBump(Printedmethod)Process:EtchUBMKingbondTrainingCourseDepositsolderpasteandreflowtoformbumpWaferBump(Printedmethod)Process:Printso
11、lderpaste&reflowSn/Pb63/37低溫95/5高溫KingbondTrainingCourseSamplemeasurebumpheight,bumpshearandbumpresistance.WaferBump(Printedmethod)Process:InspectionKingbondTrainingCourse1.Evaporativebumpsare125milsindiameterand100milshigh.2.Platedbumpsare125-175milsindiam
12、eterand25-100milshigh.Thetypicalsizeofabumpbeforereflow:KingbondTrainingCourse製程名稱製程名稱::晶片背面黏貼晶片背面黏貼WafermountingWafermounting生生產產設備設備::晶片背面黏貼機晶片背面黏貼機檢驗設備檢驗設備::顯微鏡顯微鏡製程製程說說明明::將膠帶黏貼於晶片背面將膠帶黏貼於晶片背面,,避免晶避免晶片切割時分離片切割時分離..設備名稱設備名稱::檢驗重點項目檢驗重點項目::1.1.晶片方向晶片方向Dieorientation
13、Dieorientation2.2.氣泡氣泡AirbubbleAirbubble3.3.表面皺紋表面皺紋WrinkleWrinkle製程圖例製程圖例::KingbondTrainingCourseProcess:InspectwaferKingbondTrainingCourse晶片切割晶片切割DieSawDieSaw生生產產設備設備::晶片切割機晶片切割機檢驗設備檢驗設備::顯微鏡顯微鏡製程製程說說明明::依據晶粒尺寸大小依據晶粒尺寸大小,,利用切割刀利用切割刀具具,,將晶片切割成將晶片切割成單顆的晶粒單顆的晶粒..1.1.切割道
14、寬度切割道寬度StreetwidthStreetwidth2.2.崩裂崩裂CrackCrack製程圖例製程圖例::設備名稱設備名稱::檢驗重點項目檢驗重點項目::KingbondTrainingCourse上晶片上晶片FlipChipFlipChip生生產產設備設備::晶片上片機晶片上片機檢驗設備檢驗設備::X-RAYX-RAY影像觀測機影像觀測機製程製程說說明明::依據晶粒尺寸大小依據晶粒尺寸大小,,利用上晶片利用上晶片機將單顆的晶粒機將單顆的晶粒,,分別植入基板分別植入基板或模組或模組..1.Bump1.Bump定位與定位與焊焊接情形接情形
15、2.2.晶片崩裂晶片崩裂Crack,Crack,有無短路有無短路,,斷路斷路製程圖例製程圖例::設備名稱設備名稱::檢驗重點項目檢驗重點項目::ChipBumpSubstrate/ModuleKingbondTrainingCourse上晶片流程上晶片流程FlipChipflowFlipChipflowC4processKingbondTrainingCourse上晶片流程上晶片流程FlipChipflowFlipChipflowACF&ACPKingbondTrainingCourse填膠填膠Under-fillUnder-fill設備名
16、稱設備名稱::生生產產設備設備::填膠機填膠機檢驗設備檢驗設備::X-RAYX-RAY影像觀測機影像觀測機製程製程說說明明::利用填膠機將已完成植入基板或利用填膠機將已完成植入基板或模組之每單顆的晶粒模組之每單顆的晶粒,,分別以填膠分別以填膠注入注入..1.1.有無球有無球脫脫或晶圓偏移或晶圓偏移製程圖例製程圖例::檢驗重點項目檢驗重點項目::KingbondTrainingCourseWhydoyouneedtounderfillWhydoyouneedtounderfillSolderjointreliabilityforflip
17、chipsisbasedonseveralfactors:Solderjointreliabilityforflipchipsisbasedonseveralfactors:1.Bumpalloytype2.Solderjointheight(standoff)3.DistancetoneutralpointorDNP.(Ameasurementofthecenterofmassofthedietothefarthestbumponthedie,typicallythecornerbump.)Kin
18、gbondTrainingCourse填膠製程填膠製程Under-fillUnder-fill1.1.毛細作用型毛細作用型Capillarytype):Capillarytype):利用毛細力造成膠材之流動利用毛細力造成膠材之流動..2.2.異方向導電膠異方向導電膠(Anisotropicconductiveadhesive):(Anisotropicconductiveadhesive):低溫製程低溫製程,,分膏狀分膏狀(paste)(paste)和膜狀和膜狀(film)(film)3.3.前置型前置型(Pre-appliedtype):(Pre-app
19、liedtype):小尺寸晶片小尺寸晶片(6mm),(6mm),點膠點膠(Dieattachment)(Dieattachment)後再迴後再迴焊焊(Reflow)(Reflow)KingbondTrainingCourse填膠製程填膠製程Under-fillUnder-fill製程與材料之限制製程與材料之限制::1.1.加強快速填膠與固化能力加強快速填膠與固化能力2.2.提昇其介面之黏著力提昇其介面之黏著力3.3.較低的吸水率較低的吸水率4.4.提昇低錫鉛球間距提昇低錫鉛球間距內內的流動性的流動性5.5.加強可重工性加強可重工性(rework)(rewor
20、k)KingbondTrainingCourse製程名稱製程名稱::填膠烘烤填膠烘烤UnderfillcureUnderfillcure製程製程說說明明::生生產產設備設備::填膠烤箱填膠烤箱檢驗設備檢驗設備::將填膠後之將填膠後之產產品品,,利用烤箱進行烘利用烤箱進行烘烤作業烤作業,,以消除以消除內內部所留之應力部所留之應力及固化填膠及固化填膠..顯微鏡顯微鏡斷層掃瞄機斷層掃瞄機SATSAT製程圖例製程圖例::烘烤烘烤檢驗重點項目檢驗重點項目::1.1.膠體膠體MoldbodyMoldbody設備名稱設備名稱::KingbondTraining
21、Course製程名稱製程名稱::雷射正印雷射正印LasermarkingLasermarking生生產產設備設備::雷射正印機雷射正印機檢驗設備檢驗設備::將文字將文字//字號以雷射正印到晶片字號以雷射正印到晶片背面區域背面區域,,用以辨識用以辨識產產品及批號品及批號追蹤等等追蹤等等..設備名稱設備名稱::顯微鏡顯微鏡製程圖例製程圖例::檢驗重點項目檢驗重點項目::1.1.文字文字內內容容ContentContent2.2.位置方向位置方向OrientationOrientation3.3.易辨讀易辨讀LegibilityLegibility製程製程
22、說說明明::KingbondTrainingCourseEvaporativesolderbumpingprocessWafercleanEvaporationofUBMthroughmetalmaskEvaporationofhighPbsolderthroughmaskReflowtoformsolderballA.B.C.D.95Pb/SnUBM:Cr/Cr-Cu/Cu/AuPolymidepassivationKingbondTrainingCourseElectroplatedUBMw/solderbumpingproc
23、essSputteredUBMApplyphotoresist,patternanddevelopApply2ndlayerofphotoresist.Pattern&develop.ElectroplatesolderReflowsolderA.B.D.E.PhotoresistAluminumTiW/CuorCr/CuElectroplatethickCulayerandAuCopper“Stud”or“mini-bump”C.Pb/SnStripphotoresistandetchtheUBMF.KingbondTrainingCourse